Our patent pending "Ring Pad" system does all this and more. Along with the centering benefit we have shaped the front of the pad with a hex design and engineered a flexible backing plate that will accept air, rotary and random orbit buffers; the hex face will help dissipate polish or compounds evenly, minimizing grabbing and reducing heat while the backing plate helps reduce pad stiffness. Each of our colored foam buffs has a measured cell structure that provides a different level of cutting or finishing. Used in conjunction with your favorite buffing medium, this is the ultimate buffing solution.
Ring pad patent# 8572797